The solder paste mixing machine E-PT540 is a versatile tool designed to effectively mix various materials such as solder paste, glue, slurry, and more. Its features and capabilities make it an essential asset in enhancing the quality and efficiency of PCB printing processes.
Specification
Model:E-PT540
Dimension(L×W×H): 550×550×540mm (based on the bottle)
Weight: Approx.70kg
Common-rotation velocity: 0~1200 RPM/min
Self-rotation velocity: 0~750 RPM/min
Agitation volume capacity: 500g/1000g (or specify)
Time of agitation: 3-5min
Power Source: 100-230VAC(specify),1ph
Power Consumption: 100VA max
Mixing angle: 45 degrees
Mixing capacity range: 50-250（L）,2 units/once
Key Features:
- Efficient Mixing Process: The machine employs a unique method where the solder paste is placed at a 45-degree angle and rotated along the axis direction. This innovative approach prevents the solder paste from adhering to the cover, ensuring a thorough and efficient mixing process.
- Safety Mechanisms: Equipped with double safety devices, the machine prioritizes personal security during operation, providing users with peace of mind while working with different materials.
- Air Bubble Removal: By effectively removing air bubbles while stirring, the machine enhances the screen printing process and improves PCB printing quality, ensuring a smooth and consistent application of solder paste.
- Dedicated Control Circuit: Utilizing a dedicated control circuit, the machine offers precise process control, optimizing the mixing operation for various materials and ensuring consistent results.
- Proven Speed Ratio: The machine maintains a proven speed ratio to prevent excessive solder powder usage and minimize temperature rise, safeguarding the quality of the solder paste throughout the mixing process.
- Convenient Operation: Users benefit from the convenience of not needing to remove solder paste from cold storage, streamlining the mixing process and saving time in preparation.
- Dual Can Mixing: Capable of mixing two cans of solder paste simultaneously, the machine enhances efficiency and productivity, allowing for quicker mixing of larger quantities.
- Non-Invasive Mixing: The mixing process does not require opening the solder paste box, minimizing exposure and ensuring the purity of the raw materials.
Working Principle:
The solder paste is placed at a 45-degree angle and rotated along its axis line, preventing adhesion to the cover. The simultaneous rotation of the bottle and equipment ensures thorough mixing of the solder paste.
Applicable Materials:
The solder paste mixing machine is suitable for a wide range of materials, including solder paste, silver paste, ink, epoxy resin, thermal paste, electronic paste, glue, powder foam, and other high-viscosity products. Additionally, the machine can be customized to accommodate different bottle dimensions based on customer requirements.
In conclusion, the solder paste mixing machine is a versatile and efficient solution for mixing various materials, offering precise control, safety features, and convenience in the PCB printing process. Its innovative design and advanced capabilities make it a valuable tool for enhancing production efficiency and ensuring high-quality results.